Multilayer Technology
| Multilayer Technology | |||
| Parameter | 2021 | 2022 | 2023 |
| Multilayer | 24L | 42L | 48L |
| Max. Board Size (mm) | 800 X 600 | 900 X 600 | 1000 X 600 |
| Max. Board Thickness (mm) | 4 | 5 | 6 |
| Min. Core Thickness (mm) | 0.05 | 0.05 | 0.03 |
| Layer Registration (mm) | 0.125 | 0.1 | 0.1 (Multi-Laminations) |
| Backdrill (mm) | 0.25 | 0.2 | 0.15 |
| Min. Vias Hole Size (mm) | 0.2 | 0.15 | 0.15 |
| Multi-Laminations | 2 times | 3 times | 4 times |
| Aspect Ratio | 14 : 1 | 16: 1 | 20: 1 |
| Min. Line Width/Space (mm) | 0.075/0.075 | Inner layer0.05/0.05 outer0.075/0.075 | 0.05/0.05 |
| Min. PAD (mm) | Inner layer: 0.17 | Inner layer: 0.15 | Inner layer: 0.14 |
| Outer layer: 0.18 | Outer layer: 0.16 | Outer layer: 0.15 | |
| Impedance Control | ±10% | ±7% | ±5% |
| Surface Treatment | HASL, ENIG, Immersion Silver. OSP. Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, Electroplated Silver. ENEPIG | ||
